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Private Placement: Spectra7 Microsystems (TSXV:SEV)

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The company is looking to raise gross proceeds of up to $3.5 million from the placement of up to approximately 116.7 million units (116,666,667) priced at $0.03 per unit. The units consist of 1 share and one-half a warrant, with each full warrant exercisable at $0.05 for 60 months, subject to an acceleration clause.

Additional Information:

Company: Specrta7 Microsystems
Website: http://
Stock Symbol: TSXV: SEV
Date Published: Dec 30, 2020
Transcript: Available

Video Transcript:

I’m Megan Edwards for Investmentpitch Media

Spectra7 Microsystems has announced a non-brokered private placement.

The company is looking to raise gross proceeds of up to $3.5 million from the placement of up to approximately 116.7 million units (116,666,667) priced at $0.03 per unit.

The units consist of 1 share and one-half a warrant, with each full warrant exercisable at $0.05 for 60 months, subject to an acceleration clause.

The shares are currently trading at $0.03.

The net proceeds are intended to be used for working capital to support revenue growth, the payment of interest on outstanding convertible debentures and for general corporate purposes.

Based in San Jose, California with a design center in Cork, Ireland and a technical support location in Dongguan, China, Spectra7 is a high performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution.

Spectra7 manufactures high performance analog chips with patented advanced signal processing technology, which are embedded in the connector of an active copper cable, enabling it to be ultra-thin with high-speed connectivity.

The technology is secured by more than 50 patents.

Spectra7’s proprietary high diameter performance analog silicon solution is the market-leading technology for active copper cables, which are thinner and lighter than passive copper cables, and more energy efficient than optical cables, while still able to transmit high-speed data.

The active copper cables are in turn sold to end-users in the data center, virtual reality, augmented reality, and other consumer connectivity markets.

The Global Data Center Interconnect Market is expected to reach $9.8 billion by 2025.

For more information, please visit the company’s website at www.spectra7.com, contact David Mier, CFO, at 925-858-7011 or by email at pr@spectra7.com.

For Investor Relations, contact James Bergeron, at 289-512-0541 or email ir@spectra7.com.

I’m Megan Edwards for Investmentpitch Media